Copper-clad laminate 90° peel test

Copper Clad Laminate ( Copper Clad Laminate, abbreviated as "CCL", is a sheet material made by impregnating electronic fiberglass cloth or other reinforcing materials with resin, covering one or both sides with copper foil, and then hot pressing. CCL is an important base material for PCBs. With the development of the electronic information industry, copper clad laminate technology has been widely applied along with the development of PCB technology. One important technical indicator of copper clad laminate is the adhesion strength of the copper layer. The higher the adhesion strength, the more stable the connection between the copper layer and the substrate, making it less likely to peel or fall off. Adhesion strength is characterized by peel strength. This application introduces the peel strength test of copper clad laminate. 90 ° Peel Strength Test.

The Kunpeng testing machine is equipped with pneumatic double push-pull tensile clamps and 90 ° peel clamps, which enable quick positioning and clamping of samples before testing and quick reset and replacement after testing, improving operational convenience and testing efficiency, greatly saving testing time; during the peel test, thanks to the high-precision slide rail and synchronization device of the dedicated 9 0 ° peel clamps, the board and the testing machine axis always maintain a 9 0 ° angle unchanged, ensuring the test process meets standard requirements; besides the clamps, the high precision of the testing machine main unit and a data acquisition frequency exceeding 1 000HZ can fully record all characteristic data during the peeling process, providing users with accurate and reliable test data. Coupled with intelligent testing software, it can simultaneously provide various test curves such as single sample, multiple samples, and dual coordinates, allowing different users to have a good interactive experience, safeguarding enterprise R&D, quality, and product control. 。

Experimental Section

1.1 Instruments and Clamps

BOYI 2025-001 Electronic Universal Testing Machine

500N Pneumatic Double Push-Pull Tensile Clamps

90 ° Peel Clamps

S martest Software

1.2 Analysis Conditions

Test Temperature: Room Temperature 25 Approximately ℃

Load Sensor: 1000 N ( 0.5 Grade)  

Loading Test Rate: 50.8mm/min

1.3 Samples and Treatment

In this test, samples with a fixed adhesion width of 3.18 mm were selected, and the copper foil surface was reinforced with special tape. The sample was pre-peeled to a certain distance, and the peeled end should ensure good adhesion between the copper foil and the tape to avoid delamination or edge damage, ensuring no breakage during peeling. At the same time, the peeled end length should be sufficient to be fully clamped by the upper clamp. The peel test requires the testing machine clamp holding end to always peel within 90 ± 5 ° angle relative to the substrate.

2 Test Introduction

Using BOYI 2025-001 Electronic Universal Testing Machine to conduct the test, install the sample on the 90 ° peel clamp, with the copper foil clamped in the upper clamp and the substrate clamped in the lower clamp, both forming a 9 0 ° peel state, as shown below (Figure 1). The test is conducted at a rate of 50.8mm/min . Measure the force and displacement data during the peeling process, take the average peel force during the low peel force peeling state, and obtain the peel force and peel strength data (Table 1), and generate peel curves (Figures 2 ~3). 。

Figure 1  Test System Diagram (Main Unit, Clamps)

3. Results and Conclusions

3.1 Test Results

After the test, the sample 90 ° peel test load-displacement curves are shown in (Figures 2 ~3). During peeling, subtle force fluctuations were captured by the main unit, forming stable peel curves. Using the testing software, load and displacement data can be obtained from the curves, as well as the average peel strength. Specific test results are as follows (Table 1) )。

Transverse	Longitudinal

Figure 2 90° Peel Curve (Multiple Samples)

Single Sample	'  Partial Enlargement'

Figure 3 90 ° Peel Curve (Single Sample )

Figure 4  Sample Peel State

Table 1. Test Results

From the above (Table 1) ) data and the post-peeling sample state, it can be seen that throughout the test, the sample peeling state was stable with very little fluctuation and no abnormal peeling phenomena. Each of the two groups had The average values of the 5 sample results are very close, with the difference between the maximum and minimum values within 0 .1N/ mm. The results of this test reflect Kunpeng BOYI 2025-001 Electronic Universal Testing Machine 's high precision and high stability.

4. Conclusion

In summary, Kunpeng BOYI 2025-001 Electronic Universal Testing Machine 、500N pneumatic double push-pull tensile fixture and 90 ° peeling fixture can fully meet the requirements of the " IPC-TM-650 Test Method Manual" section 2.4.8 - -Peeling strength standard requirements for metal foil boards, efficiently and effectively completing the test. Through a high-precision, high-sampling-rate testing system, various mechanical data of copper-clad laminates can be obtained reliably and stably, which is very important for the technological development of the copper-clad laminate and PCB industries, providing data support and technical assurance for product R&D, quality management, and the standardization and regulation of the industry. PCB industry.