Laminated Board Bending Strength and Bending Modulus Test

Abstract: This article introduces the use of the Kunpeng BOYI 2025 electronic universal material testing machine, combined with a three-point bending fixture, to conduct a three-point bending test on laminate boards according to Section 2.4.4 of the "IPC-TM-650 Test Methods Manual" for bending strength of laminate boards (at room temperature). The test results show that the Kunpeng BOYI 2025 electronic universal material testing machine can fully accommodate bending tests of laminate boards.

Keywords: Kunpeng BOYI 2025 electronic universal material testing machine, laminate board, PCB substrate, bending test, bending modulus

Laminate board is a type of laminated product. Laminated products are integrally formed by stacking two or more layers of resin-impregnated fibers or fabrics and bonding them under heat and pressure. Laminated products can be processed into various insulating and structural components, widely used in motors, transformers, high and low voltage electrical appliances, electrical instruments, and electronic equipment. With the development of the electrical industry, high insulation, plastic products have successively emerged. Copper-clad laminate boards for printed circuits have also rapidly developed due to the needs of the electronics industry. The performance of laminated products depends on the substrate, adhesive, and molding process. According to their composition, characteristics, and heat resistance laminated products can be divided into organic substrate laminates and inorganic substrate laminates. This application selects the commonly used PCB substrate in the circuit board industry—epoxy glass fiber laminate—as the sample for testing. Various mechanical tests of laminate boards can be performed using the universal material testing machine to characterize the mechanical properties of laminate boards, thereby ensuring quality control. The Kunpeng testing machine is equipped with a three-point bending fixture with high rigidity, ensuring accurate force analysis during bending. It also features quick connectors and adjustable supports for rapid installation and support adjustment. Additionally, the sample centering limit device allows quick placement of samples and ensures consistent positioning each time, guaranteeing result reproducibility. Besides the fixture, the testing machine's high precision and data acquisition frequency exceeding 1000Hz can fully record all characteristic data during bending, providing users with accurate and reliable test data. Coupled with intelligent testing software, it can simultaneously provide various test curves such as single sample, multiple samples, and dual coordinates, offering a good interactive experience for different users and safeguarding enterprise R&D, quality, and product control.

1. Test Section

1.1 Instruments and Fixtures

BOYI 2025-010 Electronic Universal Testing Machine

Three-point bending fixture

Smartest software

1.2 Test Conditions

Test temperature: approximately 22°C (room temperature)

Load sensor: 10kN (Class 0.5)

Loading test rate: 0.76 mm/min

Span: 25.4 mm

Diameter of indenter and supports: 10 mm

1.3 Samples and Treatment

In this test, the selected laminate board size is 76.2 mm × 25.4 mm × 1.57 mm, with a quantity of 5 pieces.

Figure 1 Standard sample dimensions

Figure 2 Test samples

2. Test Introduction

The test was conducted using the BOYI 2025-010 electronic universal testing machine. The sample was placed flat on the lower support, and the middle indenter applied force at a rate of 0.76 mm/min. Force and displacement data were measured during the process, and bending test curves were generated.

Figure 3 Test system diagram (main machine, fixture)

3. Results and Conclusions

3.1 Test Results

The specific test results are shown in Table 1 below.

Table 1. Test Results

Figure 4 - Test curves

Figure 5 - Samples after testing

From the above (Table 1) data and test curves, it can be seen that during the continuous downward pressing of the indenter, the sample force continuously increased to the maximum force point until fracture. The software can record the complete test curve throughout the process, obtaining data such as maximum force, stress, strain, and displacement stroke for analysis. After sample failure, the testing machine automatically stops upon detecting fracture. All five samples showed good reproducibility, meeting standard requirements. The test results demonstrate the high precision and stability of the Kunpeng BOYI 2025-010 electronic universal testing machine.

4. Conclusion

The above test results indicate that the Kunpeng BOYI 2025-010 electronic universal testing machine, combined with the three-point bending fixture, fully meets the requirements of Section 2.4.4 of the "IPC-TM-650 Test Methods Manual" for bending strength of laminate boards (at room temperature), efficiently and effectively completing the test. Through the high-precision, high-sampling-rate testing system, various mechanical data of laminate board materials can be obtained reliably and stably. This is very important for the technological development of plastic materials and can provide data support and technical assurance for enterprise product R&D, quality management, and the standardization and regulation of the industry.

上述试验结果表明，鲲鹏BOYI 2025-010 电子万能试验机配合三点弯曲夹具可以完全满足《IPC-TM-650试验方法手册》第2.4.4节层压板的弯曲强度(室温下)标准要求，高效高质完成试验。通过高精度高采样率的测试系统，可以获得层压板材料的各项力学数据，且稳定可靠，这对于塑料材料的技术发展非常重要，能够为企业的产品研发、品质管理，以及该行业的标准化、规范化提供数据支持与技术保障。